A big "Thank You" to all our customers and colleagues who visited us at ISTFA last November in Dallas. Please do take the time to read our latest technical papers which have been presented at ISTFA. These can be downloaded from our LIBRARY.

Our New facility includes a dedicated sample preparation area. We are the Only Bay Area Lab with full LASER (SESAME 2000) & MECHANICAL (ASAP-1 IPS) Decapsulation Capabilities --Ask for Options on Copper Bond-wired parts. We are proud to offer a full through-service -- advanced backside preparation through analytical microscopy.

The sample preparation area complements the applications and services that we offer to our customers and industry colleagues. We look forward to assisting you in the current market upturn.

Our systems range from low cost imaging/inspect modular tools in the $30K range to high end TLS systems with options for InGaAs and InSb sensor technologies into the $500 to $600K range.

One of our many advantages is the modularity and portability of the product as well as an upgrade path across generations.

We believe in providing tools to the FA community designed "By Failure Analysts for Failure Analysts". The tools are constantly evolving as we pride ourselves on delivering tools that meet specific customer needs via our modular approach.

We hold an Extensive patent portfolio.

We can offer Training/Assistance with your specific defect analysis.

Our Service Lab offers a great way to "Try before you Buy"!

Please be sure to evaluate your samples on the competing tools. Always keep in mind the importance of ease of use and success of detection of any method, rather than just taking ours or any other vendors' word for it.

We want to wish you a prosperous 2011!

Jim Colvin
President,